Seoul National Univ. DMSE
Notice

Seminar & Colloquium

Seminar & Colloquium
[세미나: 8월 22일(화), 오후 4시] University of Hanyang, Prof. Yei Hwan Jung

[세미나: 8월 22일(화), 오후 4시] University of Hanyang, Prof. Yei Hwan Jung

 

Title

Stretchable RF Electronic Devices and Packaging Technology for Wireless Wearable Devices

 

 

Speaker

University of Hanyang, Prof. Yei Hwan Jung

 

Education

- 2011. 5. B.S., Electrical Engineering, University of Illinois at Urbana–Champaign

- 2015. 5. M.S., Electrical Engineering, University of Wisconsin–Madison

- 2017. 8. Ph.D., Electrical Engineering, University of Wisconsin–Madison

 

 

EXPERIENCE

- 2021. 3. ~ present Assistant Professor, Department of Electronic Engineering, Department of Biomedical Engineering,Hanyang University

- 2019. 12. ~ 2021. 1. Postdoctoral Researcher, Querrey Simpson Institute for Bioelectronics, Northwestern University

- 2017. 10 ~ 2019. 12. Postdoctoral Researcher, School of Chemical Engineering, Sungkyunkwan University

- 2012. 9. ~ 2017. 8. HHMI International Student Research Fellow, Department of Electrical and Computer Engineering, University of Wisconsin-Madison

- 2010. 6. ~ 2012. 6. Research  Associate, Department  of  Materials  Science  and  Engineering, University of Illinois at Urbana-Champaign

 

 

| Date | Tuesday, August 22nd, 2023

| Time | 16:00 ~ 

| Venue | 33동 125호(WCU 세미나실)

 

 

[Abstract]

Stretchable  electronics  are  utilized  in  various  classes  of  wearable  electronics,  ranging from  healthcare  devices  to  skin-interfaced  haptics.  Wireless  functionalities,  including communication and power harvesting, are mandatory in almost all wearable applications. Yet,  existing  classes  of  wearable  technologies  only  demonstrate  wireless  functionalities with  modest  performance,  such  as  short  communication  distance  and  low  efficiency. These  limitations  arise  from  the  poor  electrical,  thermal  and  mechanical  managements of the integrated circuits operating on soft, stretchy materials and from the shift in the wireless  operating  frequencies  under  mechanical  strain  due  to  skin  stretch  or  bend, leading to diminished wireless signal strengths that reduce operating distance of wireless functions  or  in  the  worst  case  scenario,  total  failure  of  wireless  modes.  In  this presentation,  we  present  a  set  of  techniques  for  high-performance  wireless  stretchable electronics.  First,  we  show  stretchable  RF  electronic  devices,  including  transistors, passive  elements  and  transmission  lines  that  enable  the  processing  of  high-frequency signals.  We  then  present  a  packaging  approach  that  yield  strain-unaffected  wireless electronics  capable  of  maintaining  strong  wireless  signals  for  both  communication  and power  harvesting  applications  under  large  elastic  strains.  The  results  presented  in  this approach  enable  reliable  wireless  operations  of  diverse  wearable  electronics,  including healthcare monitoring and stimulation.

 

 

| Host | 강승균 교수(02-880-5756)