Seminar & Colloquium
[세미나: 9월 8일(금), 오후 4시] Prof. Jimin Kwon, Department of Electrical Engineering, UNIST
Title Review on Inkjet-Printed Thin Film Integrated Circuits: Materials, Integration/Design Strategies, and Applications
Speaker
Prof. Jimin Kwon, Department of Electrical Engineering, UNIST
Education
- 2018.8 ~ 2014.9 PhD, Flexible Printed Electronics, Department of Convergence IT Engineering (CITE), POSTECH
- 2014.2 ~ 2012.3 MS, Analog IC and RF Amplifier Design, Division of IT Convergence Engineering (ITCE), POSTECH
- 2011.2 ~ 2007.3 BS, Electrical Engineering, Department of Electrical Engineering (EE), POSTECH
Experience
- 2020.8 ~ Present Assistant Professor, Department of Electrical Engineering, UNIST
- 2014.2 ~ 2014.8 Researcher (Prof. Sungjune Jung)Department of Convergence IT Engineering, POSTECH
| Date | Friday, September 8th, 2023
| Time | 16:00 ~
| Venue | 33동 225호
[Abstract]
Industrial revolution in manufacturing large-area low-cost flexible electronics might be all about the development and exploitation of additive roll-to-roll printing using solution-processable electronic materials. In printed electronics, digital inkjet printing (IJP) has been of great interest for its drop-on-demand manner. This manner can eliminate not only material wastes but also premanufactured master printing plates, thereby minimizing production cost and environment pollution. Additive IJP manufacturing has succeeded to prove a prototypical concept of a flexible electronics printing fab in thin film transistors (TFTs), solar cells, non-volatile memories, light-emitting diodes, antennas, sensors, and passive components. Beyond the single devices, integration of 10–100 inkjet-printed TFTs has been recently reported in simple analog and logic building blocks for flexible integrated circuits. However, there are still questions in the practical use of such small-scale TFT integration. For stand-alone advanced thin film electronics, the additive manufacturing is now facing enormous requirements for large-scale integration of more than 100–1000 devices monolithically fabricated on foil. For last decades, the long-standing research in solution-processable materials have achieved considerable improvements of charge carrier mobility in semiconductors and conductivity in conductors. Nevertheless. advanced system design using IJP has been limited not only by material performance but also by the lack of an electronic design automation approach. This talk review recent advances of inkjet-printed integrated circuits by focusing on both materials and integration/design strategies. The materials are organic and inorganic semiconductors, dielectrics, and conductors, which are compatible with sheet-to-sheet or roll-to-roll processing. The integration/design strategies include compact modeling, layout design rule development, and integration efforts cramming more components (e.g., miniaturization, 3D integration). This talk will also discuss how the large IJP patterning feature size has limited device integration scale and how digital IJP can be more beneficial over other analog printing techniques. A more realistic application of inkjet-printed integrated circuits can be hopefully discussed in this review.
| Host | 강승균 교수(02-880-5756)