Seminar & Colloquium
[Lecture: 11월 10일(금), 오후 4시] Prof.Zhe Cheng, Peking University
Title
Heat Transport in Wide Bandgap Semiconductors and Interfaces
Speaker
Prof.Zhe Cheng, Peking University
Education
- 2019. 12. Ph.D. in Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, U.S.
- 2019 Special Research Student, Electrical Engineering, Nagoya University, Nagoya, Japan
- 2015. 5. M.S. in Mechanical Engineering, Iowa State University, Iowa, IA, U.S.
- 2013. 5. B.E. in Thermal and Power Engineering, Huazhong University of Science and Technology (HUST), Wuhan, China
Experience
- 2020. 1. ~ 2022. 12. Postdoctoral Research Associate, University of Illinois at Urbana-Champaign
- 2023. 3. ~ present Assistant Professor, Peking University
| Date | Friday, November 10th, 2023
| Time | 16:00 ~
| Venue | 온라인(https://snu-ac-kr.zoom.us/j/92527332183?pwd=NGNkV2RFWCswdHEwR2ZCM0YrZk51QT09)
ID: 925 2733 2183, PW: 1010
[Abstract]
Next-generation electronics that utilize wide and ultrawide bandgap semiconductors are rapidly advancing many technologies by providing more compact and efficient devices. However, thermal management remains a significant challenge in achieving the maximum output power of the devices. Aggressive thermal management strategies are essential to overcome these thermal limitations. This talk provides a brief summary of recent progress in heat transport in wide bandgap semiconductors and interfaces: Part 1 focuses on achieving the intrinsic high thermal conductivity of semiconductors, where we specifically discuss wafer-scale high thermal conductivity materials, such as AlN and cubic SiC, that are capable of mass production; Part 2 summarizes the high thermal boundary conductance (TBC) of technologically-important interfaces involving high thermal conductivity semiconductors that are integrated by room-temperature bonding. Thermal conductive integration of high thermal conductivity semiconductors facilitates addressing the thermal challenges and contributing to high-performance, high output power, and high reliability electronic devices.
| Host | 장혜진 교수(02-880-7096)