Seminar & Colloquium
[세미나: 5월 30일(화), 오전 11시] Prof. Yeongin Kim, University of Cincinnati
Title
Heterogeneous integration for chip-less wireless electronic skins and hemispherical organic image sensors
Speaker
Prof. Yeongin Kim, Department of Electrical and Computer Engineering, University of Cincinnati
Education
- 2011. 09 ~ 2018. 06: Ph.D. in Electrical Engineering, Stanford University
- 2011. 09 ~ 2013. 06: M.S. in Electrical Engineering, Stanford University
- 2005. 03 ~ 2011. 02: B.E. in Electrical Engineering, Korea University
RESEARCH EXPERIENCES
- 2022. 03 ~ Present: Tenure-track Assistant Professor, University of Cincinnati
- 2018. 08 ~ 2021. 10: Postdoctoral Associate, Massachusetts Institute of Technology
- 2012. 04 ~ 2018. 06: Research Assistant, Stanford University
- 2011. 04 ~ 2011. 07: Researcher, Electronic Materials Research Center, Korea Institute of Science and Technology (KIST)
| Date | Tuesday, May 30th, 2023
| Time | 11:00 ~
| Venue | 33동 327호
[Abstract]
Heterogeneous integration and 3D integrated electronics/optoelectronics can lead to disruptive improvement in IoT devices. Conventionally, wireless electronic skins rely on rigid integrated circuit chips that compromise the overall flexibility and consume considerable power. I will talk about a chip-less wireless e-skin based on surface acoustic wave sensors made of freestanding ultrathin single-crystalline piezoelectric gallium nitride membranes. Surface acoustic wave-based e-skin offers highly sensitive, low-power, and long-term sensing of strain, ultraviolet light, and ion concentrations in sweat. Also, hemispherical image sensors based on organic semiconductors and photolithography processes are introduced. Our organic hemispherical image sensor array shows the best responsivity for similar dark currents among all the reported hemispherical image sensor arrays to date.
| Host | 장호원 교수 (02-880-1720)