주영창
Joo, Young-Chang
- Email : ycjoo@snu.ac.kr
- Mailstop : 33-311
- Phone : 880-8986
- Fax : 883-8197
- Homepage : http://ndml.snu.ac.kr/
Education
Ph. D: MIT, Department of Materials Science and Engineering
M.S : Seoul National University, Department of Metallurgical Engineering
B.S : Seoul National University, Department of Metallurgical Engineering
Career
IEEE-International Interconnect Technology Conference (Sapporo Japan) General Chair
MRS(Materials Research Society) Fall Meeting (Boston, USA) Meeting Chair
Electronic Materials Letters, Editorial Board
Stanford University, Visiting Professor
Seoul National University, Department of Materials Science and Engineering, Professor
AMD (CA, USA), Senior Device Engineer
Max-Planck-Institute for Metal Research (Stuttgart, Germany), Scientist
Research Interests
1. Reliability of Interconnects and Packaging for Integrated Circuits* Electromigration, stress-migration, and TDDB of Cu/low-k interconnects
* Mechanical and electrical reliability of 3-dimensional IC using Through Si Via (TSV)2. New materials for next generation memory and display devices* Atomic migration and mechanical stress of phase-change RAM
* Characterization of the doping effect on the memory and display device
* Interconnects and electrodes for InGaZnO TFT and OLED3. Flexible and Printable Electronic and Energy devices* Materials and processing of inkjet printing
* Fatigue free electrode and transistor for flexible/stretchable devices
* Nano-hybird composite electrode for solar water splitting and super capacitor4. Transparent Conducting Electrode* Nono particle based soluble ITO
* Metal nanofiber using electro-spinning
* Electrical and mechanical properties of PEDOT:PSS
Selected Publications
1. Patents* Multi-bit memory device using multi-plug, (US 7929330) (2011)
* Method for forming metal/carbon nanotube composite film and metal/carbon nanotube composite film (KOR1134352) (2012)
* Method for evaluating degrading of flexible substrate structure (2012)
[20 domestic, 12 international patens]2. Papers* “Atomic migration in molten and crystalline Ge2Sb2Te5 under high electric field”, Appl. Phys. Lett., 95, 032104 (2009)
* “Highly conductive Ag nanoparticulate films induced by movable rapid thermal annealing applicable to roll-to-roll
processing”, J. Electrochem. Soc., 158, K165 (2011)
* “Improved mechanical performance of solution-processed MWCNT/Ag nanoparticle composite films with
oxygen-pressure-controlled annealing”, Carbon, 50, 98 (2012)
* “Influence of dopants on atomic migration and void formation in molten Ge2Sb2Te5 under high-amplitude
electrical-pulse”, Acta Mater., 60, 2012 (2012)
* “Te-Centric View of the Phase Change Mechanism in Ge-Sb-Te Alloys”, Phys. Rev. Lett., 108, 165506 (2012)
[120 publications in SCI journals]
Lab Overview
1. Characterization and enhancement of reliability in interconnects and packaging* Wafer level and package level analysis of reliability: EM, SM, TDDB, ECM2. Biocompatible polymers for cell encapsulation* Mechanical stress and adhesion in thin films using lasers, XRD and 4-point bending test
* Electrical-mechanical property coupling of metals and conducting polymer
* Microstructure analysis using TEM, EBSD, and SEM (texture, crystal structure, impurities)3. Solution processing* Post annealing of nanoparticle based printed film
* Electrospinning, Spray coating4. Development of Flexible/Stretchable devices